The solder paste stencil printing machine is generally composed of plates.Solder paste embossing circuit board transmission and other mechanisms.80% of SMT soldering defect rate comes from printing, and 70% of poor printing comes from poor solder paste stirring.For example. Poor solder paste flux and solder powder are not uniform enough and cause poor soldering.Bad solder paste is not viscous enough and tin powder flux components are volatilized and which leads to easy material drop or device offset during mounting.The solder paste contains air and there are tin explosions and sand holes during soldering.
