GXH-1S GXH-3 모듈러 마운터 밀도 배치

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모델명: GXH-1S GXH-3 GXH-3J
탑재 속도: 0.045 초/칩 80000 CPH (CPH)
구성 요소 크기: 0402(01005'') chip-120 * 90mm BGA CSP 소켓 및 기타 특수 모양의 구성 요소
Nozzle head: 4 nozzle heads/per head 12 nozzles
전기 근원: AC200v~440v 50-60Hz
PCB Size: 50 x 50~460 x 460mm
소요 시간: 주식
지불 조건: 전신환
GXH-1S GXH-3 모듈러 마운터 밀도 배치


기능:
. Increasing ratio of chip-based components for mobile electronic devices — cellphones, MP3 [MPEG (Moving Picture Experts Group) Audio Layer-3] players, digital cameras —, laptop computers, flat- screen TVs (televisions), and increasing digital components and systems in vehicles.
. High- volume production has been largely superceded by adaptable production for large or small volume to achieve high-mix low-volume production, and further shrinkage of production lead times to meet the needs
. Achieve a throughput about 20% better than previous placement equipment with 95,000 chips per hour
· Small Electrical Part Gap Requirements: 0201 parts is 0.13 mm과 01005 components is 0.08 밀리미터. And gap continues to shrink
. Inter-axis Correction Control by Both-side Linear Motors. Respective positions of Y1 and Y2 axes are monitored and synchronized with each other
. Supporting gang fly recognition of 12 components simultaneously, image processing takes approximately 5 ms per chip

When high-speed mounter GXH-1S GXH-3 fail. 유지 보수해야 할 다음과 같은 소모품 및 부품을 처리해야 합니다.:

예비 부품 이름
예비 부품 이름
SENSOR, PELEC 6301457413
COPLLING 6301250441
Shock Absorber 6301256177
MOTOR,DC 6301405506
SEAL 6301376028
PCB MOUNT 6301612584
MOTOR NL KYF-M861N-000
SERVO DRIVER Y axis KYK-M861A-00
SERVO DRIVER X axis KYK-M860F-00
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