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기능:
. Increasing ratio of chip-based components for mobile electronic devices — cellphones, MP3 [MPEG (Moving Picture Experts Group) Audio Layer-3] players, digital cameras —, laptop computers, flat- screen TVs (televisions), and increasing digital components and systems in vehicles.
. High- volume production has been largely superceded by adaptable production for large or small volume to achieve high-mix low-volume production, and further shrinkage of production lead times to meet the needs
. Achieve a throughput about 20% better than previous placement equipment with 95,000 시간당 칩 수
· Small Electrical Part Gap Requirements: 0201 parts is 0.13 mm과 01005 components is 0.08 밀리미터. And gap continues to shrink
. Inter-axis Correction Control by Both-side Linear Motors. Respective positions of Y1 and Y2 axes are monitored and synchronized with each other
. Supporting gang fly recognition of 12 components simultaneously, image processing takes approximately 5 ms per chip
When high-speed mounter GXH-1S GXH-3 fail. 유지 보수해야 할 다음과 같은 소모품 및 부품을 처리해야 합니다.:
예비 부품 이름
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예비 부품 이름
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SENSOR, PELEC | 6301457413 |
COPLLING | 6301250441 |
Shock Absorber | 6301256177 |
MOTOR,DC | 6301405506 |
SEAL | 6301376028 |
PCB MOUNT | 6301612584 |
MOTOR NL | KYF-M861N-000 |
SERVO DRIVER Y axis | KYK-M861A-00 |
SERVO DRIVER X axis | KYK-M860F-00 |