| Numéro de modèle: |
Speedline MPM 125 |
| Printing area: |
609.6mm×508mm |
| Printing release film: |
0mm to 6.35mm |
| Printing speed: |
305mm/sec |
| Printing pressure: |
0 to 22.7kg |
| Steel mesh size: |
737mm×737mm |
| Taille: |
L1593×1214×1638 (mm) |
| Poids: |
872Kg |
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The solder paste printing machine is generally composed of plates, solder paste, embossing, circuit board transmission and other mechanisms. Its working principle is: first fix the circuit board to be printed on the printing positioning table, then the left and right scrapers of the printing machine will leak the solder paste or red glue to the corresponding pad through the stencil. The transfer table is input to the pick and place machine for automatic placement.
Technical Parameters of MPM125 automatic solder paste printing machine:
PCB substrate processing:
Board size (X×Y) 609.6mm×508mm (24″×20″)
Small board size (X×Y) 50.8mm×50.8mm (2″×2″)
Board thickness size 0.2mm (0.008″) to 5.0mm (0.20″)
Printing parameters
Printing area 609.6mm×508mm
Printing release film 0mm to 6.35mm
Printing speed is as fast as 305mm/sec
Printing pressure 0 to 22.7kg
Steel mesh size 737mm×737mm
performance
System alignment accuracy and repeatability ±12.5 microns (±0.00005″) @60, Cpk is greater than or less than 2.0*
Cycle time 13sec
Exigences en matière d’alimentation 200 to 240VAC (±10%) single phase @50/60Hz, 15Un
Air requirements 100psi at 4 cfm (standard operating mode) À 18 cfm (vacuum wipe) (7 bar@5L/S to 12L/S), 12.7mm (0.5″) diameter pipe
Taille: L1593×1214×1638 (mm)
Poids: 872Kg
