0402(01005'') chip-120*90mm BGA CSP Socket et autres composants de forme spéciale
Nozzle head:
4 nozzle heads/per head 12 Buses
Source électrique:
AC200v ~ 440v 50-60Hz
PCB Size:
50 x 50~460 x 460mm
Delai:
Stock
Modalités de paiement:
T/T
Fonctionnalités:
. Increasing ratio of chip-based components for mobile electronic devices — cellphones, MP3 [MPEG (Moving Picture Experts Group) Audio Layer-3] players, digital cameras —, laptop computers, flat- screen TVs (televisions), and increasing digital components and systems in vehicles.
. High- volume production has been largely superceded by adaptable production for large or small volume to achieve high-mix low-volume production, and further shrinkage of production lead times to meet the needs
. Achieve a throughput about 20% better than previous placement equipment with 95,000 chips per hour · Small Electrical Part Gap Requirements: 0201 parts is 0.13 mm and 01005 components is 0.08 mm. And gap continues to shrink
. Inter-axis Correction Control by Both-side Linear Motors. Respective positions of Y1 and Y2 axes are monitored and synchronized with each other
. Supporting gang fly recognition of 12 components simultaneously, image processing takes approximately 5 ms per chip
When high-speed mounter GXH-1S GXH-3 fail. Nous devons nous occuper des consommables et des pièces à entretenir suivants:
