| Nom du modèle: |
CP45FV NEO |
| Marque: |
Samsung (en anglais seulement |
| Système: |
Advanced flying full vision |
| Tact time mount speed: |
0.178 SEC/Puce 20224 CPH(IPC9850) |
| Taille des composants: |
0603(0201'')chip-42mm |
| Taille du circuit imprimé: |
460 x 400mm |
| Source électrique: |
AC220v~240v 50-60Hz 6kVA |
| Taille(W*D*H): |
1650x1540x1370 |
| Delai: |
Stock |
| Modalités de paiement: |
T/T |
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CP45FV Neo is a high speed flexible placement machine with its unique technology. It performs high mounting at 20200cph. It can place components in the range from tiny 0201” to large QFPs. From BGAs to fine pitch CSPs.
Feature of Head:
. SHSV Flying vision technology
. High speed and accurate control of Z-motion with 6 servo motors
. Recognition for max 22mm chip even CSP with placement rate at 14900cph(IPC9850)
①Vacuum valve ②Theta axis motor ③Flying vision ④Fiducial camera
Flying vision vs conventional aliger-Laser aliger
Laser sliger: 1. Recognize shadows of image 2. Inspect side of the component but Cant not be used for the pitch IC BGA or CSP
Flying vision: 1. Recognize actual image 2. Inspect bottom of the component
