NMP-W2 Montage für elektronische Komponenten

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Modellbezeichnung: NPM-W2
Number: NM-EJM7D
Placement head: H08/H03/H12/H16 nozzle head
Mounting speed: 6500cph~38500cph (0.554s/QFP~0.094s/chip)
Größe der Komponenten: 0402 03015 0603 chip
pneumatic source: 0.5Mpa, 200L/min (A.N.R.)
Elektrische Quelle: 3 phase AC200 220~480V 2.8kVA
Größe(W*D*H): 1280x2332x1444
Vorlaufzeit: 10 Werktage
Zahlungsbedingungen: T/T
NMP-W2 Montage für elektronische Komponenten


We usually use this equipment with loader screen printer SPG KohYoung SPI conveyor NPM-W NPM-TT2 reflow oven and then AOI unloading form a complete SMT placment line.

Customer could option H16 or H08 lightweight nozzle head or H03 V2 H12. The system software includes Placement height control system APC system. Supplying units includes Feeder cart (30 inputs). Tape feeder can be optional includes Thin type single tape feeder Autoload feeder Single stick feeder 3-slot stick feeder Single tray feeder(20 components types) Twin Tray feeder(40 components types). Automatic unit Automatic tape splicing unit.

NPM-W Features:

. Higher productivity and quality with printing, placement and inspection process integration: Depending on the PCB you produce, you can select High-speed mode or High-accuracy mode.
. For larger boards and larger components: PCBs up to a size of 750 x 550 mm with component range up to L150 x W25 x T30 mm
. Higher area productivity through dual lane placement: Depending on the PCB you produce, you can select an optimal placement mode – “Independent” “Alternate” or “Hybrid”

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