Modellbezeichnung: |
I-Pulse M10 M20 mounter |
Leiterplattengröße(LxWmm): |
50 x 30~740 x 510
50 x 30~1210 x 510 |
Geschwindigkeit des Montierens: |
0.15 Sek./Chip 24000 CPH |
Größe der Komponenten: |
01005 Chip-120*90mm BGA CSP-Sockel und andere speziell geformte Komponenten |
Number of component types: |
M10 72 M20 144 types |
Elektrische Quelle: |
AC200v ~ 440v 50-60Hz |
Größe(W*D*H): |
1250x1750x1420
1750x1750x1420 |
Vorlaufzeit: |
Lager |
Zahlungsbedingungen: |
T/T |
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Funktionen:
. A single unit Manufacturing Center designed for surface mounting, dispensing and inspecting
. Product loading fast speed and accuracy as well as highly versatile mounting options from ultra-small chips to large components, these models are hybrids with their mounting heads and dispensing heads intermingled allowing alternate dispensing and mounting
. Head variation can also be set to a 6-axis 6-theta, or 12-axis 2-theta configurations
· Max components place within 140 types. 0402~120x90mm
. New camera system D-SCAN for smaller chips with max 3000mm/sec identify.
When pick and place M10 M20 fail. We need to deal with the following consumables and parts to be maintained: