0402(01005'') Chip-120*90mm BGA CSP-Sockel und andere speziell geformte Komponenten
Düsenkopf:
4 Düsenköpfe/pro Kopf 12 Düsen
Elektrische Quelle:
AC200v ~ 440v 50-60Hz
Leiterplattengröße:
50 x 50 ~ 460 x 460 mm
Vorlaufzeit:
Lager
Zahlungsbedingungen:
T/T
Funktionen:
. Increasing ratio of chip-based components for mobile electronic devices — cellphones, MP3 [MPEG (Moving Picture Experts Group) Audio Layer-3] players, digital cameras —, laptop computers, flat- screen TVs (televisions), and increasing digital components and systems in vehicles.
. High- volume production has been largely superceded by adaptable production for large or small volume to achieve high-mix low-volume production, and further shrinkage of production lead times to meet the needs
. Achieve a throughput about 20% better than previous placement equipment with 95,000 Chips pro Stunde · Small Electrical Part Gap Requirements: 0201 parts is 0.13 mm and 01005 components is 0.08 Mm. And gap continues to shrink
. Inter-axis Correction Control by Both-side Linear Motors. Respective positions of Y1 and Y2 axes are monitored and synchronized with each other
. Supporting gang fly recognition of 12 components simultaneously, image processing takes approximately 5 ms per chip
When high-speed mounter GXH-1S GXH-3 fail. We need to deal with the following consumables and parts to be maintained: